Probe and method of making same

ABSTRACT

Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a National Stage application under 35 U.S.C. § 371of and claims the benefit of International Application No.PCT/KR2004/000559 filed on Mar. 16, 2004, which claims priority toKorean Application No. 10-2003-0016634, filed on Mar. 17, 2003, which ishereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to a probe and a method of making thesame, and more particularly to a probe having a minute pitch, with whicha probe card corresponding to arrangement of pads formed with a denseshape or other various shapes on a wafer is made, and a method of makingthe same.

BACKGROUND ART

Generally, semiconductor integrated circuit devices are tested whenmanufacturing the devices, after manufacturing the devices, or whenpackaging the devices, in order to verify whether the devices aremanufactured while the whole or partial electric characteristics of thedevices exactly correspond to the original design of the devices.

The equipment for performing the above-mentioned test is probe equipmentwith a test apparatus and a probe card. The probe card serves toelectrically connect a various electrical signals-generating part in thetest apparatus and a pad in the semiconductor integrated circuit device,or an electric signal detecting part in the test apparatus and the padin the semiconductor integrated circuit device.

One of the conventional probe cards is a needle-type probe card, whichis shown in FIG. 1. The needle-type probe card includes needle-typeprobes 12 each having a bent end. The body of each needle-type probe 12is disposed on a prescribed position of a fixing member 13, and is thenfixedly attached to the fixing member 13 by means of epoxy. The fixingmember 13 is attached to a main circuit board 11. The other end of theneedle-type probe 12 is connected to a prescribed circuit of the maincircuit board 11 by means of soldering. In this way, the probe card isprepared. Elasticity is required in order to stably connect the needleto a pad of the semiconductor integrated circuit device. However, thelevel and position of the needle-type probe is distorted when it isrepeatedly used. Consequently, the conventional needle-type probe cardhas a drawback in that maintenance and repair of the probe are requiredwhen the needle-type probe card is used.

Another conventional probe card is a vertical-type probe card, which isshown in FIG. 2. At the upper surface of a main circuit board 21 isdisposed a fixing plate 23, and at the lower surface of the main circuitboard 21 are disposed a plurality of guide plates 24. Through the maincircuit board 21, the fixing plate 23, and the guide plates 24 areformed a plurality of through-holes, which are regularly arranged at thecorresponding positions of the main circuit board 21, the fixing plate23, and the guide plates 24. Through through-holes are insertedneedle-type probes 22, respectively. The ends of the needle-type probesdrawn out from the fixing plate 23 are connected to prescribed circuitsof the main circuit board 21, respectively, by means of soldering. Inthis way, the probe card is prepared. However, the vertical-type probecard also has a drawback in that the level of the probe is distortedwhen it is repeatedly used, and thus the elasticity thereof is lost, aswith the above-mentioned needle-type probe. Furthermore, thevertical-type probe card has another drawback in that electricalinteraction is caused between adjacent needles when the probe card isused to test a high-speed operating type semiconductor integratedcircuit since the needles are long and arranged adjacent to each other,and thus accuracy of the test is lowered.

Any one of the needle-type probe card and the vertical-type probe cardhas a relatively large size. On the other hand, an element, which is tobe tested, becomes increasingly miniaturized and precise according tothe advancement of the technology. Consequently, any one of theneedle-type probe card and the vertical-type probe card has a drawbackin that a miniaturized and precise element is not appropriately tested.In other words, no relatively large probe card can test all elements ona wafer, as the arrangement of a plurality of pads on the elementsformed on the wafer is compact and dense. As a result, it is requiredthat several tests be performed on one wafer.

In order to overcome the above-mentioned problems, there have beeninvented compact and miniaturized probe cards. Representative examplesof such compact and miniaturized probe cards are a micro spring-typeprobe card and a cantilever-type probe card.

The micro spring-type probe card is shown in FIG. 3 a, and the microspring-type probe card is manufactured as follows: A bump 33 is formedon a substrate 32 as shown in FIG. 3 b. To the bump 33 is connected aprobe-shaped wire 34 a by means of a wire bonder. The wire 34 a isplated at the surface thereof so that the wire 34 a is thick and strong.An additional silicon wafer 35 is etched, and then plated, to form asupporting beam 34 b and a probe tip 34 c. The supporting beam 34 b isbonded to the wire 34 a so that a spring-type probe 34 with the probetip 34 is formed. After the spring-type probe 34 is formed as mentionedabove, the silicon wafer 35 is removed. The substrate 32 with theabove-mentioned construction is attached to a main circuit board 31 bymeans of an additional reinforcing member 36 as shown in FIG. 3 a.

The cantilever-type probe card is shown in FIG. 4 a, and thecantilever-type probe card is manufactured as follows: A bump 43 isformed on a substrate 42 as shown in FIG. 4 b. On an additional siliconwafer 44 are formed a probe tip 45 b and a supporting beam 45 a.Subsequently, one end of the bump 43 is bonded to one end of thesupporting beam 45 a to form a probe 45 with the probe tip 45 b. Afterthe probe is formed as mentioned above, the silicon wafer 44 is removed.The substrate 42 with the above-mentioned construction is attached to amain circuit board 41 by means of an additional reinforcing member 46 asshown in FIG. 4 a.

By means of the micro spring-type probe card and the cantilever-typeprobe card, a test on a wafer having integrated elements formed thereonis smoothly performed.

However, the probe beam and the probe tip are arranged level with eachother (34 b and 34 c in FIG. 3 b, 45 a and 45 b in FIG. 4 b). When padson an element, which is to be tested, are aggregated more closely, andwhen the arrangement of the pads on the element is complicated, aproblem is caused. In the case that the cantilever-type probe card shownin FIG. 4 a is used to test a wafer having the arrangement of elements51 as shown in FIG. 5 a, for example, it is required that thecantilever-type probe card be constructed as shown in FIG. 5 b.Specifically, it is required that all probes 61 a be disposed on a unitsubstrate 61 (FIG. 5 b) of a probe card 60 (FIG. 5 b) having a sizecorresponding to that of the element in order to test all pads 51 a(FIG. 5 a) on each element. When the probes are arranged along thesides, however, it may be not possible to arrange the probes at corners.In this case, therefore, some of the probes are arranged over adjacentunit substrates 61. Consequently, it is required that tests on the waferbe performed two or more times.

In the case that the pads on a wafer, which is to be tested, arearranged in straight lines, the cantilever-type probe has an arrangementas shown in FIGS. 6 a and 6 b. The pitch p indicated in the FIG. 6 acorresponds to the distance between two adjacent pads on the wafer. Itis easily understood that the pitch p is larger than the width w of eachprobe 65. When the distance between the pads on the wafer is smallerthan the width w of the probe 65, therefore, the test cannot be rapidlyperformed.

In the conventional probe cards as describe above, increase of thenumber of the probes is restricted. Consequently, it is impossible totest a plurality of semiconductor devices at once, which does notsatisfy the desires of the semiconductor device manufacturers who aretrying to increase efficiency of the test.

DISCLOSURE OF THE INVENTION

Therefore, the present invention has been made in view of the aboveproblems, and it is an object of the present invention to provide aprobe having a minute pitch, with which a probe card corresponding toarrangement of pads formed with a dense shape or other various shapes ona wafer is made, and a method of making the same.

In accordance with one aspect of the present invention, the above andother objects can be accomplished by the provision of a probe having aprescribed thickness and formed in the shape of a flat plate, the probecomprising: a body part bent at the middle thereof so that the body partis elastically tensioned or compressed when a tension force or acompression force is applied to the body part at the upper and lowerends thereof, a connection part integrally formed with the lower end ofthe body part, the connection part being fixed to a substrate; and a tippart integrally formed with the upper end of the body part, the tip partcontacting a pad of an element.

In accordance with another aspect of the present invention, there isprovided a probe card including probes, each of the probes having aprescribed thickness and formed in the shape of a flat plate, whereinthe probe comprises: a body part bent at the middle thereof so that thebody part is elastically tensioned or compressed when a tension force ora compression force is applied to the body part at the upper and lowerends thereof; a connection part integrally formed with the lower end ofthe body part, the connection part being fixed to a substrate; and a tippart integrally formed with the upper end of the body part, the tip partcontacting a pad of an element, wherein the body part comprises: ahorizontal section; and a first vertical section bent vertically upwardfrom one end of the horizontal section, the first vertical section beingintegrally connected to the tip part; a second vertical section bentvertically downward from the other end of the horizontal section, thesecond vertical section being integrally connected to the connectionpart, wherein the lengths of the horizontal section, the first verticalsection, and the second vertical section of the body part are changed toform more than two kinds of probes, and wherein the more than two kindsof probes are fixedly attached on the substrate of the probe card.

In accordance with yet another aspect of the present invention, there isprovided a method of making a probe, comprising: a step 1 for applying asacrifice layer on the whole upper surface of a silicon wafer, coatingthe sacrifice layer at the upper surface thereof with a photoresist, andattaching a first mask having a shape pattern of a probe to the uppersurface of the photoresist; a step 2 for exposing and developing thephotoresist by means of the first mask, and removing the first mask; astep 3 for performing electrolytic plating on the upper surface of thesacrifice layer having the pattern fixed by means of the exposure anddevelopment to form a first metallic film; and a step 4 for removing thephotoresist and etching the sacrifice layer to separate the firstmetallic film from the silicon wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a cross-sectional view showing the fixation of a conventionalprobe;

FIG. 2 is a cross-sectional view showing the fixation of anotherconventional probe;

FIGS. 3 a and 3 b are a cross-sectional view showing the fixation ofanother conventional probe and a cross-sectional view showing theprocess of making the probe, respectively;

FIGS. 4 a and 4 b are a cross-sectional view showing the fixation ofstill another conventional probe and a cross-sectional view showing theprocess of making the probe, respectively;

FIG. 5 a is a plan view showing an example of an element, which is to betested;

FIG. 5 b is a plan view illustrating the manufacture of a conventionalprobe card for checking the element shown in FIG. 5 a;

FIGS. 6 a and 6 b are a plan view and a perspective view showing thedisposition of conventional probes, respectively;

FIG. 7 a is a perspective view and a bottom view respectively showing apreferred embodiment of the present invention;

FIG. 7 b is a perspective view and a bottom view respectively showinganother preferred embodiment of the present invention;

FIG. 7 c is a perspective view and a bottom view respectively showinganother preferred embodiment of the present invention;

FIG. 7 d is a perspective view and a bottom view respectively showinganother preferred embodiment of the present invention;

FIG. 8 is a cross-sectional view illustrating the shape of FIGS. 7 a to7 d;

FIG. 9 is a perspective view showing still another preferred embodimentof the present invention;

FIG. 10 is a cross-sectional view illustrating the shape of FIG. 9;

FIGS. 11 a and 11 b are a perspective view and a plan view respectivelyshowing the disposition of the present invention;

FIGS. 12 a and 12 b are a perspective view and a plan view respectivelyshowing a probe card according to a preferred embodiment of the presentinvention;

FIG. 12 c is a front view of a probe shown in FIG. 12 a;

FIGS. 13 a to 13 g are cross-sectional views illustrating a method ofmaking a probe according to the present invention; and

FIGS. 14 a and 14 b are views respectively illustrating the shape of amask used in the method of making the probe according to the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

Probes according to preferred embodiments of the present invention areshown in FIGS. 7 a to 7 d. Referring to the left side of FIG. 7 a, aprobe 70 is formed in the shape of a bent plate, and is made of metal.The probe 70 has a body part 70 b, which is bent at the middle thereofso that the body part 70 b is elastically compressed and expanded whenan external force is applied to the body part 70 b. When a tension forceor a compression force is applied to the body part 70 b at the upper andlower ends thereof, the body part 70 b is elastically tensioned orcompressed within a prescribed allowable limit. The probe 70 also has aconnection part 70 a, which is integrally formed with the lower end ofthe body part 70 b. The connection part 70 a serves as a supporting beamfor supporting the body part 70 b when one end of the body part 70 b isconnected to a substrate. The probe 70 further has a tip part 70 cintegrally formed with the upper end of the body part 70 b. The tip part70 c directly contacts a pad of an element to be tested. The bottom ofthe probe 70, which is seen in the direction X at the left side of FIG.7 a, is shown at the right side of FIG. 7 a. It can be seen from FIG. 7a that the tip part 70 c is more extended to the left side than theconnection part 70 a. This means that the tip part 70 c is disposed atthe outermost side of the probe 70 in the horizontal direction at theleft side of FIG. 7 a. The reason why the probe 70 is constructed asdescribed above is that adjacent tip parts can be arranged densely instraight lines by an intersection arrangement of the probes, which willbe described later.

Referring to the left side of FIG. 7 b, a probe 71 comprises a mainprobe 72, which is formed in the shape of a bent plate and made ofmetal, and an auxiliary probe 73, which is also formed in the shape of abent plate and made of metal. The auxiliary probe 73 is similar to themain probe 72 except for the shape of one end thereof. The auxiliaryprobe 73 is attached to the main probe 72. The main probe 72 comprises:a body part 72 b, which is bent at the middle thereof so that the bodypart 72 b is elastically compressed and expanded when an external forceis applied to the body part 72 b; a connection part 72 a integrallyformed with one end of the body part 72 b, the connection part 72 aserving as a supporting beam for supporting the body part 72 b when oneend of the body part 72 b is connected to a substrate; and a tip part 72c integrally formed with the other end of the body part 72 b, the tippart 72 c directly contacting a pad of an element to be tested.Similarly, the auxiliary probe 73 comprises: a body part 73 b, which isbent at the middle thereof so that the body part 73 b is elasticallycompressed and expanded when an external force is applied to the bodypart 73 b; and a connection part 73 a integrally formed with one end ofthe body part 73 b, the connection part 73 a serving as a supportingbeam for supporting the body part 73 b when one end of the body part 73b is connected to a substrate. The bottom of the probe 71, which is seenin the direction X at the left side of FIG. 7 b, is shown at the rightside of FIG. 7 b. It can be seen from FIG. 7 b that the tip part 72 c ismore extended to the left side than the connection parts 72 a and 73 a.The reason why the probe 71 is constructed as described above is thatadjacent tip parts can be arranged densely in straight lines by anintersection arrangement of the probes. When the probes are arrangedwhile intersecting each other as shown in FIG. 11 a, the distancebetween tip parts 110 c is decreased. FIG. 11 b is a plan viewsimplifying the dense arrangement of the probes. It can be seen fromFIG. 11 b that the distance between the tip parts 10 c, i.e., the pitchp, is smaller than that of the conventional cantilever-type probe (SeeFIGS. 6 a and 6 b). The width w1 of the tip part of the probecorresponds to half of the width w2 of the body part of the probe.Consequently, it is possible to manufacture a probe card having a pitchp smaller half than that of the conventional cantilever-type probe.

A probe 74 shown in FIG. 7 c is similar to the probe 71 shown in FIG. 7b except that an auxiliary probe 75 is disposed below a main probe 76.The auxiliary and main probes 76 and 75 are attached to each other. Atone end of the main probe 76 is formed a tip part 76 c. Consequently,the probe 74 of FIG. 7 c is symmetrical to the probe 71 of FIG. 7 b.

A probe 77 shown in FIG. 7 d is a combination of the probes of FIGS. 7 band 7 c. Specifically, the probe 77 comprises: a main probe 79 having atip part 79 c formed at one end thereof; and auxiliary probes 78 and 80attached to lower and upper sides of the main probe 79, respectively.The auxiliary probes 78 and 80 are provided for reinforcing the strengthof the probe.

FIG. 8 is a cross-sectional view of the probe or the main probe shown inFIGS. 7 a to 7 d. Reference symbol d1 of FIG. 8 indicates the length bywhich a tip part 81 c of a probe 81 is extended from the left end of aconnection part 81 a of the probe 81, and reference symbol d2 of FIG. 8indicates the height from the connection part 81 a to the end of the tippart 81 c. With the provision of various probes having different valuesof d1 and d2, it is possible to manufacture a probe card provided withthe various probes attached to a substrate, corresponding to thearrangement of complicated or dense pads, which will be describe later.

A probe according to still another preferred embodiment of the presentinvention is shown in FIG. 9, in which the probe has a body part bent ata right angle. As shown in FIG. 9, the probe 90 comprises: a body part90 b, which is bent at a right angle so that the body part 90 b iselastically compressed and expanded when an external force is applied tothe body part 90 b; a connection part 90 a integrally formed with oneend of the body part 90 b, the connection part 90 a serving as asupporting beam for supporting the body part 90 b when one bent end ofthe body part 90 b is connected to a substrate; and a tip part 90 cintegrally formed with the other bent end of the body part 90 b, the tippart 90 c directly contacting a pad of an element to be tested.

As in the above-mentioned preferred embodiments shown in FIGS. 7 a to 7d, the probe 90 shown in FIG. 9 may be prepared as a main probe, and anauxiliary probe may be attached to one side of the probe 90.Alternatively, two auxiliary probes may be attached to both sides of theprobe 90, respectively. The detailed description and the drawingsthereof will not be given.

FIG. 10 is a cross-sectional view of the probe 90 shown in FIG. 9.Reference symbol D1 of FIG. 10 indicates the height from one end of ahorizontal body part 91 b of a probe 91 to the end of a tip part 91 c,reference symbol D2 of FIG. 10 indicates the length of the horizontalbody part 91 b, and reference symbol D3 of FIG. 10 indicates the heightfrom the other end of the horizontal body part 91 b to a connection part91 a. The parts of the body part 91 b corresponding to the referencesymbols D1, D2, and D3 are referred to as a first vertical section, ahorizontal section, and a second vertical section.

With the provision of various probes having different values of D1, D2,and D3, i.e., the first vertical section, the horizontal section, andthe second vertical section of the body part 91 b, as in the probe shownin FIG. 8, it is possible to manufacture a probe card provided withvarious probes attached to a substrate, corresponding to the arrangementof complicated or dense pads. When D2 is increased, it is required toincrease the thickness of the probe since the elasticity is severelychanged. The proportional relation between D2 and the thickness of theprobe necessary to maintain the elasticity of the probe constantly maybe applied to the design of the probe by showing the relation obtainedfrom experiments in the form of a graph.

FIGS. 12 a to 12 c are views illustrating an application of the probe 90shown in FIG. 90. FIG. 12 a is a partial perspective view of a probecard, and FIG. 12 b is a plan view of the probe card shown in FIG. 12 a.The arrangement of the probes on the probe card is carried out toperform a test on the arrangement of pads on the wafer as shown in FIG.5 a, as mentioned in the background art. It can be seen from the abovedrawings that probes attached on each unit substrate 125 must bearranged in the area of the unit substrate 125. As shown in FIG. 12 a,various probes having different values of D1, D2, and D3 as describedwith reference to FIG. 10, are attached on the unit substrate.Specifically, on the unit substrate are attached: first probes 121 eachhaving D1H, which is larger than D1, and D3L, which is smaller than D3;second probes 122 each having D1L, which is smaller than D1, and D3H,which is larger than D3; and third probes 123 each having D1L, which issmaller than D1, and D2H and D3H, which are larger than D2 and D3,respectively. The first, second, and third probes have the same totalheights as a standard probe 120 shown in FIG. 12 c. The first, second,and third probes are attached on the unit substrate as follows: Thesecond probes 122 are attached along one side of the unit substrate 125,and the first probes 121 are attached along the adjacent side of theunit substrate, as shown in FIG. 12 a. At the corner between theadjacent sides of the unit substrate are attached the first probes 121.Since the height of the horizontal section of each of the first probes121 is smaller than that of the horizontal section of each of the secondprobes 122, no interference is created between the probes. In the casethat the space where the first probes 121 are attached at the corner ofthe unit substrate is insufficient, the third probes 123 are attachedfrom the inside of the unit substrate 125 as shown in FIG. 12 a. Theattachment of the probes is shown in FIG. 12 b, which is a plan viewshowing the attachment of the probes. The attachment of the probes ismanually carried out by means of a laser beam.

A method of making a probe according to a preferred embodiment of thepresent invention will now be described with reference to FIGS. 13 a to13 f, which are cross-sectional views of a substrate showing main stepsof making the probe. The probe making method of the present invention isprovided for manufacturing the probe shown in FIG. 7 b.

To the whole upper surface of a silicon wafer 130 is applied a copperlayer 131, which is a sacrifice layer, as shown in FIG. 13 a. The copperlayer 131 is coated at the upper surface thereof with a photoresist 132.On the upper surface of the photoresist 132 is attached a first mask 133having a shape pattern of a desired probe. The first mask 133 has theshape as shown in FIG. 14 a. As can be seen from the enlarged part ofFIG. 14 a, the shape of the space part 133 a of the mask corresponds tothat of the main probe 72 shown in FIG. 7 b. The photoresist 132 isexposed and developed by means of the first mask 133. Subsequently, thefirst mask 133 is removed as shown in FIG. 13 b. Electrolytic plating isperformed on the upper surface of the copper layer 131 having thepattern fixed by means of the exposure and development. The plated uppersurface of the copper layer is ground to form a first metallic film 134having the shape of the main probe 72 (FIG. 7 b) as shown in FIG. 13 c.

As shown in FIG. 13 d, the photoresist 132 and the first metallic film134 are coated at the upper surfaces thereof with a photoresist 135. Onthe upper surface of the photoresist 135 is attached a second mask 136having a shape pattern of a desired probe. The second mask 136 has theshape as shown in FIG. 14 b. As can be seen from the enlarged part ofFIG. 14 b, the shape of the space part 136 a of the mask corresponds tothat of the auxiliary probe 73 shown in FIG. 7 b. The photoresist 135 isexposed and developed by means of the second mask 136 of FIG. 13 d.Subsequently, the second mask 136 is removed as shown in FIG. 13 e.Electrolytic plating is performed on the upper surface of the firstmetallic film 134 having the pattern fixed by means of the exposure anddevelopment. The plated upper surface of the first metallic film isground to form a second metallic film 137 having the shape of theauxiliary probe 73 (FIG. 7 b) as shown in FIG. 13 f.

Finally, the photoresists 132 and 135 of FIG. 13 f are removed, and thenthe copper layer 131 of FIG. 13 f is etched by means of a wet etchingmethod so that the first metallic film 134 and the second metallic film137 are separated from the silicon wafer 130. Consequently, a probe 140as shown in FIG. 13 s is manufactured.

The probes according to other preferred embodiments of the presentinvention may be manufactured by means of the above-described probemaking method. The probe 70 of FIG. 7 a may be obtained by forming onlythe first metallic film 134 (FIG. 13 c). The probe 74 of FIG. 7 c may beobtained by carrying out the steps related to the second mask 136 (FIG.13 d) and then carrying out the steps related to the first mask 133(FIG. 13 a). The probe 77 of FIG. 7 d may be obtained by furthercarrying out the steps related to the second mask 136 (FIG. 13 d) beforethe manufacturing process of the probe 74 of FIG. 7 c is finished tofurther form another second metallic film 137 (FIG. 13 f).

Also, the probe 90 of FIG. 9 and other probes (not shown) similar to theprobes shown in FIGS. 7 b to 7 d may be manufactured by means of thesame steps as mentioned above. In this case, however, it is requiredthat the space part of the mask be deformed according to the shape ofthe probe.

INDUSTRIAL APPLICABILITY

As apparent from the above description, the present invention provides aprobe having a minute pitch, with which a probe card corresponding toarrangement of pads formed with a dense shape or other various shapes ona wafer is made.

Although the preferred embodiments of the present invention have beendisclosed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

1. A probe having a prescribed thickness and formed in the shape of aflat plate, the probe comprising: a main probe including: a body partbent at the middle thereof so that the body part is elasticallytensioned or compressed when a tension force or a compression force isapplied to the body part at the upper and lower ends thereof; aconnection part integrally formed with the lower end of the body part,the connection part being fixed to a substrate; and a tip partintegrally formed with the upper end of the body part, the tip partcontacting a pad of an element; and an auxiliary probe being fixedlyattached to one side of the main probe, the auxiliary probe including: abody part identical to the body part of the main probe, the body partbeing attached to one side of the body part of the main probe so thatthe body part is elastically tensioned or compressed when a tensionforce or a compression force is applied to the body part at the upperand lower ends thereof, thereby reinforcing the strength of the probe;and a connection part identical to the connection part of the mainprobe, wherein the auxiliary probe is not provided with a tip part. 2.The probe as set forth in claim 1, wherein the body part comprises: ahorizontal section; a first vertical section bent vertically downwardfrom one end of the horizontal section, the first vertical section beingintegrally connected to the connection part; and a second verticalsection bent vertically upward from the other end of the horizontalsection, the second vertical section being integrally connected to thetip part.
 3. The probe as set forth in claim 2, wherein the lengths ofthe horizontal section, the first vertical section, and the secondvertical section of the body part are different from one another to formmore than two kinds of probes.
 4. The probe as set forth in claim 1 or2, wherein the tip part is formed such that the end of the tip part,contacting the pad of the element, is disposed at the outermost side ofthe main probe in the horizontal direction.
 5. The probe as set forth inclaim 1, further comprising another auxiliary probe is further fixedlyattached to the other side of the main probe.
 6. A probe card includinga main probe and an auxiliary probe, each of the probes having aprescribed thickness and formed in the shape of a flat plate, whereinthe main probe comprises: a body part bent at the middle thereof so thatthe body part is elastically tensioned or compressed when a tensionforce or a compression force is applied to the body part at the upperand lower ends thereof a connection part integrally formed with thelower end of the body part, the connection part being fixed to asubstrate; and a tip part integrally formed with the upper end of thebody part, the tip part contacting a pad of an element; and an auxiliaryprobe being fixedly attached to one side of the main probe, theauxiliary probe including: a body part identical to the body part of themain probe, the body part being attached to one side of the body part ofthe main probe so that the body part is elastically tensioned orcompressed when a tension force or a compression force is applied to thebody part at the upper and lower ends thereof, thereby reinforcing thestrength of the probe; and a connection part identical to the connectionpart of the main probe, wherein the auxiliary probe is not provided witha tip part, wherein the body part comprises: a horizontal section; and afirst vertical section bent vertically upward from one end of thehorizontal section, the first vertical section being integrallyconnected to the tip part; a second vertical section bent verticallydownward from the other end of the horizontal section, the secondvertical section being integrally connected to the connection part,wherein the lengths of the horizontal section, the first verticalsection, and the second vertical section of the body part are differentfrom one another to form more than two kinds of probes, and wherein themore than two kinds of probes are fixedly attached on the substrate ofthe probe card.